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E-MIAL∶ｈｄｑ＠ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ Package Dimensions And Materials
1.600.701.701.503.10ｗｗｗ．ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ2-2.052.201+3.502-1:ANODE2:CATHODEChipMaterialAIGaInPEmitting ColorYellowLens ColorWater Clear1+ 图片未注差（Unless otherwise noted)±0.1 胶体外观公差 胶体伸出尺寸（NOTE)(Encapsulation tolerance)(Dimensions of produded resin flange)±0.25Max1.0２
Absolute Maximum Rating at TA=25°C
Item
Symbol
Absolute Maximum Rating
UnitmAmAVmWV°C°C
Forward CurrentPeak Forward CurrentReverse VoltagePower DissipationElectrostaic dischargeOperation TemperatureStorage Temperature
Lesd Soldering Temperature
IfIfpVRPDESDToprTstgTsol
5015051303000-30 -- +80-40 -- +80
Max.245°C for 5sec Max
IFP Conditions:Pulse Width≤10mser duty≤1/10
Tsol Conditions: 5mm form the base of the epoxy bulb
Typical Optical/Electrode Characteristic
Item
Forward VoltageReverse Current50 % Power AngleLuminous IntensityThe Main WavelengthRecommend Forward Current
SymbolVfIr2θ1/2IVλDIf(rec)
Condition
IF=50mAVr=5VIF=50mAIF=50mAIF=50mA--
Min.2.0--
Typ.----40
Max.2.610
UnitVuAdeg
4900585
----50
8200595
MCD
NMmA
３
Typical Optical/Electrode Characteristic Curves(Ta=25℃ Unless Otherwise Noted)
RELATIVE RESPONSE 100%=1.2e-G01
100806040200
400500
600
700
800nm
Forward Current vs. Ambient Temperature
Relstive Intensity vs.Ambient Temperature
Forward Current If (mA)Relative Intensity IV(mcd)Ambient Temperature Ta(°C)Ambient Temperature Ta(°C)
Forward Current vs. Ambient Temperature
Forward Current vs. Ambient Temperature
Forward Current If (mA)Forward Voltage Vf(V)Forward Voltage Vf(V)
0°
-30°
30°
Ambient Temperature Ta(°C)
-60°60°
-90°
100%
80%
60%
40%
20%
0
20%
40%
60%
80%
90°
100%
Luminous Spertrum(Ta=25℃)
SPECTRAL RADIANCE
４
Range of bins
IV Ranks(If=50mA)
Bin CodeIV(MCD)
Bin244900-6300
Bin256300-8200
VF Ranks(If=50mA)
Bin CodeVF(V)
Bin12.0-2.2
Bin22.2-2.4
Bin32.4-2.6
λD Ranks(If=50mA)
Bin Code
Bin1585-590
Bin2590-595
λD(NM)
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MOISTURE PROOF PACKAGE防潮包装
●When moisture is absorbed into the SMT package it may vaproize and expand during soldering. There is a possibility that this can cause
exfoliation of the contacts and damage the optical characteristics of the LEDs.For this reason ,the moisture proof package is used to keep moisture to a minimum in the package.
当水分吸收到SMT封装，会可能在焊接过程中扩大，就有可能材料出现剥落和损坏LED的光学特性；
出于这个原因，防潮铝袋是用来保持水分的最小包装
●The moisture proof package is made absorbent material (silica gel desiccants)is inserted into the aluminium moisture proof bag.将防潮包装制成的吸收性材料(硅胶干燥剂)放入到防潮铝袋中
●The silica gel desiccants change from blue to red if moisture had penertrated bags.
如果有水分进入防潮铝袋中，硅胶干燥剂由蓝色变为红色
STORAGE CONDITIONS储存条件
●Before opeing the package :打开包装前
The LEDs should be kept at 30℃ or less and 60％ RH or less.LED应该保存在≤30℃，≤60%RH环境中
The LEDs should be used within 3 months.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel desiccants)is recommended.
LED保存在防潮铝袋真空包装，防潮铝袋中放硅胶干燥剂时，必须在3个月内使用，
●After opening the package :打开包装后
After this bag is opened , devices that will sujected to infraed reflow , vapor -phase reflow , or equivalent processing Must be:
防潮包装打开后，将过回流焊处理时，必须：
a)Mounted within 24 hours at factory condition of ≤30℃/60％RH.在≤30℃/60％RH环境中24小时内使用完
６
b)If unused LEDs remain, they should be stored in the moisture proof package ,such as sealed containers with package of moisture absorbent material (silica gel deaiccants). It is also recommended to return the LEDs to the original moisture proof bag and reseal the moisture prrof bag again . Stored at ≤20％RH.
若不用LED时，LED应该被储存在防潮环境中，如密封的容器(防潮柜)，另外，还建议LED返回到原来的防潮袋中，再次重新真空包装，储存在≤20％RH.
●If the moiature basorbent material (silica gel deaiccants)has faded away or the LEDs have exceeded the storage time ,baking treatment should be performed using the following conditions.Backing treatment : 1.more than 12 hours at 130℃（Bulk material, ie without Reel)
如果硅胶干燥剂已消失或LED已经超过存储时间，须烘烤处理，烘烤条件：1.130℃烘烤超过12小时(散装材料，即不带卷盘包装)
●Please avoid rapaid transitions in ambient temperature,especially in high humidity environments where condensation can ocuur.请避免在高温环境，尤其是高湿度的环境中作业
STATIC ELECTRICITY静电防护
●Static electricity or surge voltage damages the LEDs
It is recommended that a wrist band or an anti-electrostaic glove be used when handing the LEDs.
静电或过电压会损坏LED，建议在作业时使用防静电手环或者防静电手套
●All devices equipment and machinery must be properly grounded. It is
recommended that precautions be taken against surge voltage to the eauipment that mounts the LEDs.
所有设备和机台必须正确接地，以避免过电压加载到LED上
７
Moisture sensitivity level : level 6. 湿度敏感等级：6级
Soldering Condition(Pb-Free) 焊接条件（无铅）
1.Iron:烙铁
Soldering Iron:30W Max 烙铁：30W（Max)
Temperature 350°C Max 温度：350度（Max)
Soldering Time:3 Seconds Max(One Time) 焊接时间：3秒（Max)一次
2.Reflow Soldering Profile (Pb-Free)2.回流焊条件 (无铅)
Pre-heatPre-heat timePeak temperatureDipping timeCondition
120-150°C120 sec. Max.245°C Max.10 sec. Max.See below
预热温度预热时间峰值温度峰值温度时间条件
120-150°C120 sec. Max.245°C Max.10 sec. Max.见以下
温度Temperature
2.5-5°C
Pre-heating120-150°C2.5-5°C/sec
120 sec. Max.
120 sec. Max.
245°CMax
Above200°C 60sec.Max
时间 Time
８
Reliability Persult Test
ClassifcationLife Test
Test Item
Room Temperatuer DC Operating Life TestThermal Shock TestTemperature Cycle Test
Test Condititons
Ta=25℃
±5℃,IF=50mA
-10℃±5℃←→+100℃±5℃ 5min. 10sec. 5min-55℃±5℃←→+85℃±5℃ 30min. 5min. 30minTa=85℃±5℃RH=85%±0.5%RH
Test Duration
1000Hrs50cycles50cycles1000Hrs
Sample
AC/RE
Size5PCS5PCS5PCS5PCS5PCS5PCS5PCS5PCS
0/10/10/10/10/10/10/10/1
EnvironmentTest
High Temperature High Humidity test
High Temperature Storage
Ta=100℃±5℃Ta=-55℃±5℃Ta=245℃±5℃
Load 2.5N(0.25kgf) 0° ~ 90° ~0°
1000Hrs1000Hrs
Low Temperature Storage
MechanicalTest
Resistance toSoldering HeatLead Integrity
5sec3times
Criteria for Judging The Damage
ItemForward VoltageReverse Current
Luminous Intensity
SymbolVFIRIV
Test ConditionsIF=50mAVR=5VIF=50mA
Criteria for JudgmentMin.
Max.U.S.L.*1.2U.S.L.*2.2
L.S.L.**×0.7
U.S.L.* : Upper Standard LevelL.S.L.** : Lower Standard Level
９