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专利名称：CHIP PACKAGES WITH POWER
MANAGEMENT INTEGRATED CIRCUITS ANDRELATED TECHNIQUES
发明人：Mou-Shiung Lin,Jin-Yuan Lee申请号：US125361申请日：20091222
公开号：US20100165585A1公开日：20100701
专利附图：
摘要：Chip packages having power management integrated circuits are described.Power management integrated circuits can be combined with on-chip passive devices, and
can provide voltage regulation, voltage conversion, dynamic voltage scaling, and batterymanagement or charging. The on-chip passive devices can include inductors, capacitors, orresistors. Power management using a built-in voltage regulator or converter can providefor immediate adjustment of the voltage range to that which is needed. This
improvement allows for easier control of electrical devices of different working voltagesand decreases response time of electrical devices. Related fabrication techniques aredescribed.
申请人：Mou-Shiung Lin,Jin-Yuan Lee
地址：Hsin-Chu TW,Hsin-Chu TW
国籍：TW,TW
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