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TCM809/TCM810

3-Pin Microcontroller Reset Monitors

Features

•Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies

•140msec Minimum RESET Time Out Period•RESET Output to VDD = 1.0V (TCM809)•Low Supply Current, 9µA (typ.)•VDD Transient Immunity

•Small 3-Pin SC-70 and SOT-23B Packages•No External Components•Push-Pull RESET Output•Temperature Range:

-Industrial, SC-70 (E): -40°C to +85°C

-Extended, SOT-23, SC-70 (V): -40°C to +125°C

General Description

The TCM809 and TCM810 are cost-effective systemsupervisor circuits designed to monitor VDD in digitalsystems and provide a reset signal to the host proces-sor, when necessary. No external components arerequired.

The RESET output is typically driven active within65µsec of VDD falling through the reset voltage thresh-old. RESET is maintained active for a minimum of140msec after VDD rises above the reset threshold.The TCM810 has an active-high RESET output, whilethe TCM809 has an active-low RESET output. The out-put of the TCM809/TCM810 is valid down to VDD = 1V.Both devices are available in 3-Pin SC-70 and SOT-23Bpackages.

The TCM809/TCM810 is optimized to reject fasttransient glitches on the VDD line. A low supply currentof 9µA (typ., VDD = 3.3V) make these devices suitablefor battery-powered applications.

Applications

•••••

Computers

Embedded Systems

Battery-Powered Equipment

Critical Microcontroller Power Supply MonitoringAutomotive

Pin Configurations

SOT-23B/SC-70

GND1

TCM809/TCM810Typical Application Circuit

VDD

3VDD

VDD

PICmicro®Microcontroller

2

RESET INPUT

(Active-Low)

GND

TCM809 RESETTCM810 (RESET)

2

3 VDD

TCM809

RESETGND

1

Note: 3-Pin SOT-23B is equivalent to

JEDEC TO-236.

 2004 Microchip Technology Inc.DS21661C-page 1

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TCM809/TCM810

1.0

ELECTRICAL

CHARACTERISTICS

PIN FUNCTION TABLE

NAMEGND

Ground.

FUNCTION

Absolute Maximum Ratings†

Supply Voltage (VDD to GND)..........................................6.0VRESET, RESET....................................– 0.3V to (VDD +0.3V)Input Current, VDD.........................................................20mAOutput Current, RESET, RESET...................................20mAdV/dt (VDD).............................................................100V/µsecOperating Temperature Range....................– 40°C to +125°CPower Dissipation (TA = 70°C):

3-Pin SOT-23B (derate 4mW/°C above +70°C)......320mW3-Pin SC-70 (derate 2.17mW/°C above +70°C)......174mWStorage Temperature Range.......................– 65°C to +150°CMaximum Junction Temperature, TJ..............................150°C

† Notice: Stresses above those listed under “Maximum ratings” maycause permanent damage to the device. This is a stress rating only andfunctional operation of the device at those or any other conditionsabove those indicated in the operational listings of this specification isnot implied. Exposure to maximum rating conditions for extended peri-ods may affect device reliability.

RESET (TCM809)RESET push-pull output

remains low while VDD is below the reset voltage threshold and for 240msec (140msec min.) after VDD rises above reset threshold.RESET (TCM810)RESET push-pull output

remains high while VDD is below the reset voltage threshold and for 240msec (140msec min.) after VDD rises above reset threshold.VDD

Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V).

ELECTRICAL CHARACTERISTICS

VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note1).

Parameter

VDD RangeSupply Current

Reset Threshold (Note2)

ICCVTHSym

Min1.01.2——4.5.504.314.253.933.3.043.002.2.852.592.552.282.25

Reset Threshold TempcoVDD to Reset Delay,Reset Active Time Out Period

——140

Typ——1294.63—4.38—4.00—3.08—2.93—2.63—2.32—3065320

Max5.55.530254.704.754.454.504.0.103.113.152.963.002.662.702.352.38——560

VVVVVVVVVVVVppm/°Cµsecmsec

VDD = VTH to (VTH – 100mV) (Note2)TCM8xxZ:TCM8xxR:TCM8xxS:TCM8xxT:TCM809J:TCM8xxM:VµAUnitsV

Test Conditions

TA = 0°C to +70°CTA = – 40°C to +125°CTCM8xxL/M/J:TCM8xxR/S/T/Z:TCM8xxL:

VDD < 5.5VVDD < 3.6VTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°CTA = +25°C

TA = – 40°C to +125°C

Note1:Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.

2:RESET output for TCM809, RESET output for TCM810.

DS21661C-page 2 2004 Microchip Technology Inc.

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TCM809/TCM810

ELECTRICAL CHARACTERISTICS (CONTINUED)

VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note1).

Parameter

RESET Output Voltage Low (TCM809)

SymVOL

Min———

RESET Output Voltage High (TCM809)RESET Output Voltage Low (TCM810)RESET Output Voltage High (TCM810)

VOHVOLVOH

0.8 VDDVDD – 1.5

——0.8 VDD

Typ————————

Max0.30.40.3——0.30.4—

VVVUnitsV

TCM809R/S/T/Z:TCM809L/M/J:

Test Conditions

VDD = VTH min, ISINK = 1.2mA VDD = VTH min, ISINK = 3.2mA

VDD > 1.0V, ISINK = 50µA

TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500µATCM809L/M/J: VDD > VTH max, ISOURCE = 800µATCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2mATCM810L/M:

VDD = VTH max, ISINK = 3.2mA

1.8Note1:Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.

2:RESET output for TCM809, RESET output for TCM810.

 2004 Microchip Technology Inc.DS21661C-page 3

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TCM809/TCM810

2.0

Note:

TYPICAL PERFORMANCE CHARACTERISTICS

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

18TCM8xx/R/S/T/Z, No Load16141210820-40-20020406080100120VDD = 1VVDD = 3VPower-up Reset Timeout (µsec)Supply Current ( µA)350300250200150100500-40-200204060Temperature (°C)80100120VDD = 5V450400Temperature (°C)FIGURE 2-1:Temperature.

16TCM8xx/L/M/J, No Load1412Supply Current ( µA)10820-40-200Supply Current vs.

FIGURE 2-3:vs. Temperature.

1.001Power-up Reset Time Out

VDD = 5VNormalized Reset Threshold1VDD = 3V0.999VDD = 1V0.9980.99720406080100120-40-20020406080100120Temperature (°C)Temperature (°C)FIGURE 2-2:Temperature.

Supply Current vs.

FIGURE 2-4:Normalized Reset Threshold vs. Temperature.

DS21661C-page 4 2004 Microchip Technology Inc.

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TCM809/TCM810

3.0

3.1

APPLICATIONS INFORMATION

VDD Transient Rejection

Combinations above the curve are detected as abrown-out or power-down condition. Transient immu-nity can be improved by adding a capacitor in closeproximity to the VDD pin of the TCM809/TCM810.

The TCM809/TCM810 provides accurate VDD monitor-ing and reset timing during power-up, power-down andbrown-out/sag conditions. These devices also rejectnegative-going transients (glitches) on the power sup-ply line. Figure3-1 shows the maximum transient dura-tion vs. maximum negative excursion (overdrive) forglitch rejection. Any combination of duration and over-drive that lies under the curve will not generate a resetsignal.

VDDVTHOverdrive3.2

RESET Signal Integrity During Power-Down

DurationMaximum Transient Duration (µsec)400320240160TCM8XXL/M/J (SOT-23)80 (SOT-23)01 TCM8XXZ/R/S/TTA = +25°CThe TCM809 RESET output is valid to VDD = 1.0V.

Below this voltage the output becomes an \"open cir-cuit\" and does not sink current. This means CMOSlogic inputs to the microcontroller will be floating at anundetermined voltage. Most digital systems arecompletely shut down well above this voltage.However, in situations where RESET must be main-tained valid to VDD = 0V, a pull-down resistor must beconnected from RESET to ground to discharge straycapacitances and hold the output low (Figure3-2). Thisresistor value, though not critical, should be chosensuch that it does not appreciably load RESET undernormal operation (100kΩ will be suitable for mostapplications). Similarly, a pull-up resistor to VDD isrequired for the TCM810 to ensure a valid high RESETfor VDD below 1.0V.

VDD

VDDTCM809

RESET

R1

100kΩ

5 1000100Reset Comparator Overdrive[VTH - VDD] (mv)GND

130VDD to Reset Delay (µsec)120110100908070605040301101001000TCM8XXZ/R/S/T (SC-70)TCM8XXL/M/J (SC-70)FIGURE 3-2:The addition of R1 at the RESET output of the TCM809 ensures that the RESET output is valid to VDD = 0V.

Reset Comparator Overdrive (mV)[VTH - VDD] (mv)FIGURE 3-1:Maximum Transient

Duration vs. Overdrive for Glitch Rejection at +25°C.

 2004 Microchip Technology Inc.DS21661C-page 5

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TCM809/TCM810

3.3

Controllers and Processors With Bidirectional I/O Pins

VDD

Some microcontrollers have bidirectional reset pins.Depending on the current drive capability of the control-ler pin, an indeterminate logic level may result if thereis a logic conflict. This can be avoided by adding a4.7kΩ resistor in series with the output of the TCM809/TCM810 (Figure3-3). If there are other components inthe system that require a reset signal, they should bebuffered so as not to load the reset line. If the othercomponents are required to follow the reset I/O of themicrocontroller, the buffer should be connected asshown with the solid line.

Buffer

Buffered RESET To Other System Components

TCM809

4.7kΩ

RESETGND

PICmicro®Micro-controller

RESETGND

FIGURE 3-3:Interfacing the TCM809 to a Bidirectional RESET I/O.

DS21661C-page 6 2004 Microchip Technology Inc.

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TCM809/TCM810

4.0

4.1

PACKAGING INFORMATION

Package Marking Information

3-Pin SOT-23B

3-Pin SC-70

cdef

cde

Top Side

Part Number

fgh

Bottom Side

SOT-23/SC-70

J1J2J3J4J5J6J7JZJYJXJVJUJT

JS (SC-70 package only)

SOT-23/SC-70

K1K2K3K4K5K6KZKYKXKVKU

TCM809LENBTCM809MENBTCM809TENBTCM809SENBTCM809RENBTCM809JENBTCM809ZENB

TCM809LVNB/TCM809LVLBTCM809MVNB/TCM809MVLBTCM809TVNB/TCM809TVLBTCM809SVNB/TCM809SVLBTCM809RVNB/TCM809RVLBTCM809JVNB/TCM809JVLBTCM809ZVNB/TCM809ZVLB

Part Number

TCM810LENBTCM810MENBTCM810TENBTCM810SENBTCM810RENBTCM810ZENB

TCM810LVNB/TCM810LVLBTCM810MVNB/TCM810MVLBTCM810TVNB/TCM810TVLBTCM810SVNB/TCM810SVLBTCM810RVNB/TCM810RVLB

Legend: 1

23456Note:

Part Number + temperature range and voltage (two-digit code)Part Number + temperature range and voltage (two-digit code)Lot ID number

Year and work weekYear and work weekYear and work week

In the event the full Microchip part number cannot be marked on one line, it will becarried over to the next line thus limiting the number of available characters for customerspecific information.

 2004 Microchip Technology Inc.DS21661C-page 7

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TCM809/TCM810

3-Lead Plastic Small Outline Transistor (NB) (SOT-23)

EE1

2

B

n

p1

p1

D

α

c

A

A2

φβ

L

A1

Number of PinsPitch

Outside lead pitch (basic)Overall Height

Molded Package ThicknessStandoff§Overall Width

Molded Package WidthOverall LengthFoot LengthFoot Angle

Lead ThicknessLead Width

Mold Draft Angle TopMold Draft Angle Bottom* Controlling Parameter§ Significant Characteristic

Units

Dimension Limits

npp1AA2A1EE1DLφcBαβ

MIN

INCHES*NOM

3.038.076.040.037.002.093.051.115.0185.006.01755

MAX

.035.035.000.083.047.110.0140.004.01500.044.040.004.104.055.120.02210.007.0201010

MILLIMETERS

MINNOM

30.961.92

0.1.010.880.950.010.062.102.371.201.302.802.920.350.45050.090.140.370.440505

MAX

1.12

1.020.102.1.403.040.55100.180.511010

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.JEDEC Equivalent: TO-236Drawing No. C04-104

DS21661C-page 8 2004 Microchip Technology Inc.

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TCM809/TCM810

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

EE1B2p1D31pacA A2bLA1UnitsDimension LimitsNumber of PinsPitchOutside lead pitch (basic)Overall HeightMolded Package ThicknessStandoffOverall WidthMolded Package WidthOverall LengthFoot LengthLead ThicknessLead WidthMold Draft Angle TopMold Draft Angle Bottompp1AA2A1EE1DLcBabINCHESMIN3.026 BSC..051 BSC..031.031.000.071.045.071.004.003.0068˚8˚MAX.043.039.0004.094.053.0.016.010.01612˚12˚MILLIMETERS*MINMAX30.65 BSC.1.30 BSC.0.801.100.801.000.00.0101.802.401.151.351.802.250.100.410.080.250.150.408˚12˚8˚12˚*Controlling ParameterNotes:Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusionsshall not exceed .005\" (0.127mm) per side.JEITA (EIAJ) Equivalent: SC70Drawing No. C04-104 2004 Microchip Technology Inc.DS21661C-page 9

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TCM809/TCM810

4.2

Product Tape and Reel Specifications

EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY)

TopCoverTape

FIGURE 4-1:

A0

W

K0B0P

TABLE 1:

CaseOutlineNBLB

CARRIER TAPE/CAVITY DIMENSIONS

Package TypeSOT-23SC-70

3L3L

CarrierDimensionsWmm88

Pmm44

A0mm3.152.4

CavityDimensions

B0mm2.772.4

K0mm1.221.19

OutputQuantityUnits30003000

ReelDiameter in

mm

180180

FIGURE 4-2:3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONSDeviceMarkingUser Direction of FeedPin 1W, Widthof CarrierTapePin 1P, PitchStandard Reel Component OrientationReverse Reel Component OrientationDS21661C-page 10 2004 Microchip Technology Inc.

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TCM809/TCM810

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.Device

XResetThreshold

Device:

TCM809:Supervisor circuit with active-low RESET outputTCM810:Supervisor circuit with active-high RESET outputLMJTSRZEV

=======4.63V4.38V4.00V3.08V2.93V2.63V2.32V

XTemperatureRange

XXXXXPackage

Examples:

a)

TCM809LENB713:

SOT-23B-3-TR,

Microcontroller 4.63VReset Monitor, -40°C to +85°C,Tape and Reel.SC-70-3-TR,

Microcontroller 4.63VReset Monitor,-40°C to +125°C,Tape and Reel.SOT-23B-3-TR,

Microcontroller 4.63VReset Monitor,-40°C to +125°C,Tape and Reel.SOT-23B-3-TR,

Microcontroller 4.38VReset Monitor,-40°C to +85°C,Tape and Reel.SOT-23B-3-TR,

Microcontroller 2.63VReset Monitor,-40°C to +125°C,Tape and Reel.SC-70-3-TR,

Microcontroller 4.38VReset Monitor,-40°C to +125°C,Tape and Reel.

VDD

b)TCM809LVLB713:

VDD Reset Threshold:

c)TCM809LVNB713:

a)TCM810MENB713:

Temperature Range:

=-40°C to +85°C=-40°C to +125°C

b)

TCM810RVLB713:

Package:

NB713=SOT-23B, 3-pin (Tape and Reel)LB713=SC-70, 3-pin (Tape and Reel)

c)

TCM810TVLB713:

Sales and SupportData Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:1.2.3.

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc.DS21661C-page 11

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TCM809/TCM810

NOTES:

DS21661C-page 12 2004 Microchip Technology Inc.

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Note the following details of the code protection feature on Microchip devices:•••

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

••

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorized exceptwith express written approval by Microchip. No licenses areconveyed, implicitly or otherwise, under any intellectualproperty rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PROMATE, PowerSmart and rfPIC are registered

trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense,

FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

 2004 Microchip Technology Inc.DS21661C-page 13

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WORLDWIDE SALES AND SERVICE

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No. 11, O’Shaugnessey RoadBangalore, 560 025, India

Tel: 91-80-22290061 Fax: 91-80-22290062

Italy

Via Quasimodo, 1220025 Legnano (MI)Milan, Italy

Tel: 39-0331-742611 Fax: 39-0331-466781

Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, CanadaTel: 905-673-0699 Fax: 905-673-6509

Japan

Benex S-1 6F

3-18-20, ShinyokohamaKohoku-Ku, Yokohama-shiKanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, NetherlandsTel: 31-416-690399 Fax: 31-416-690340

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson StreetEpping 2121, NSWAustralia

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

United Kingdom

505 Eskdale RoadWinnersh TriangleWokingham

Berkshire, England RG41 5TUTel: 44-118-921-5869Fax: 44-118-921-5820

02/17/04

DS21661C-page 14 2004 Microchip Technology Inc.

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