MPXAZ4100ARev 1, 05/2005
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The Freescale MPXAZ4100A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Freescale MAP sensor a logical and economical choice for automotive system designers.
The MPXAZ4100A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.Features••••••
Resistant to high humidity and common automotive media1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
Ideally Suited for Microprocessor or Microcontroller Based SystemsTemperature Compensated Over –40°C to +125°CDurable Thermoplastic (PPS) Surface Mount Package
MPXAZ4100A SERIES
INTEGRATEDPRESSURE SENSOR
20 TO 105 kPA (2.9 TO 15.2 psi)
0.3 TO 4.9 V OUTPUT
SMALL OUTLINE PACKAGES MPXA4100A6U/6T1CASE 482-01 MPXA4100AC6U/AC6T1CASE 482A-01PIN NUMBER(1)
1234
N/CVSGNDVOUT
5678
N/CN/CN/CN/C
Typical Applications••
Manifold Sensing for Automotive SystemsAlso Ideal for Non-Automotive Applications
ORDERING INFORMATION
Device Type
Options
CaseNo.
MPX SeriesOrder No.
PackingOptions
Device Marking
SMALL OUTLINE PACKAGE (MPXAZ4100A SERIES)Basic Absolute, ElementsElement Only
Absolute, Element Only
482482
MPXAZ4100A6UMPXAZ4100A6T1
Rails
MPXAZ4100A
1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Tape & ReelMPXAZ4100A
Rails
MPXAZ4100A
Ported Absolute, Axial 482AMPXAZ4100AC6UElementsPort
Absolute, Axial 482AMPXAZ4100AC6T1Tape & ReelMPXAZ4100APort
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VS
SensingElement
Thin FilmTemperatureCompensation
andGain Stage #1
Gain Stage #2
andGroundReferenceShift Circuitry
Vout
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTSfor small outline package devices.
Figure1. Fully Integrated Pressure Sensor Schematic
Table1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)Storage TemperatureOperating Temperature
SymbolPMAXTSTGTA
Value400–40 to +125–40 to +125
UnitkPa°C°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
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Table2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure3 required to meet electrical specifications.)
Characteristic
Pressure Range(1)Supply Voltage(2)Supply Current
Minimum Pressure Offset @ VS = 5.1 Volts(3)Full Scale Output @ VS = 5.1 Volts(4)Full Scale Span
@ VS = 5.1 Volts(5)Accuracy(6)SensitivityResponse Time(7)
Output Source Current at Full Scale OutputWarm-Up Time(8)Offset Stability(9)
1.1.0 kPa (kiloPascal) equals 0.145 psi.
2.Device is ratiometric within this specified excitation range.
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.6.Accuracy (error budget) consists of the following:
•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•TcSpan:Output deviation over the temperature range of 0 to 85°C, relative to 25°C.•TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
(0 to 85°C)(0 to 85°C)(0 to 85°C)(0 to 85°C)
SymbolPOPVSIoVoffVFSOVFSS—V/PtRIo+——
Min204.85—0.2254.870———————
Typ—5.17.00.30.9514.59—541.00.120±0.5
Max1055.35100.3885.032—±1.8—————
UnitkPaVdcmAdcVdcVdcVdc%VFSSmV/kPamsmAdcms%VFSS
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Figure2 illustrates an absolute sensing chip in the basic chip carrier (Case 482).
Figure4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure3. The output will saturate outside of the specified pressure range.A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and
Fluoro SiliconeGel Die Coat
P1
Wire Bond
durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.Figure3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Die
Stainless Steel Cap
Thermoplastic Case
Lead Frame
Absolute Element
Sealed Vacuum Reference
Die Bond
Figure2. Cross Sectional Diagram SOP
(not to scale)
+5 V
Vout
Vs
IPS
1.0 µF
0.01 µF
GND
Output
470 pF
Figure3. Recommended Power Supply Decoupling and Output Filtering(For additional output filtering, please refer to Application Note AN16.)
5.04.54.03.5Output (Volts)3.02.52.01.51.00.5
5101520253035404550556065707580859095100105110Pressure (ref: to sealed vacuum) in kPa
0
MAX
MIN
Transfer Function:
Vout = Vs* (.01059*P-.152) ± ErrorVS = 5.1 Vdc
Temperature = 0 to 85°C20 kPa TO 105 kPaMPXAZ4100A
TYP
Figure4. Output versus Absolute Pressure
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Transfer Function (MPXAZ4100A)
Nominal Transfer Value:Vout = VS (P x 0.01059 - 0.1518)
± (Pressure Error x Temp. Factor x 0.01059 x VS)VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPXAZ4100A Series
4.03.0
TemperatureErrorFactor
2.01.00.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.
Temp-400 to 85+125
Multiplier
313
Pressure Error Band3.02.0Pressure Error (kPa)1.00.0
20
-1.0-2.0-3.0
Pressure 20 to 105 (kPa)
Error (Max)±1.5 (kPa)
40
60
80
100
120
Pressure (in kPa)
Error Limits for Pressure
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INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct
footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.66016.76
0.100 TYP 8X2.54
0.060 TYP 8X1.52
0.3007.62
0.100 TYP 8X2.54
inchmm
SCALE 2:1
Figure5. SOP Footprint (Case 482)
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PACKAGE DIMENSIONS
-A-45D8 PL0.25 (0.010)MTBSAS-B-8G1NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.INCHESMINMAX0.4150.4250.4150.4250.2120.2300.0380.0420.100 BSC0.0020.0100.0090.0110.0610.0710˚7˚0.4050.4150.7090.725MILLIMETERSMINMAX10.5410.7910.5410.795.385.840.961.072.54 BSC0.050.250.230.281.551.800˚7˚10.2910.5418.0118.41SNCPIN 1 IDENTIFIERJKMH-T-SEATINGPLANEDIMABCDGHJKMNSCASE 482-01ISSUE O
SMALL OUTLINE PACKAGE
-A-45D8 PL0.25 (0.010)MTBSASN-B-8G1NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.INCHESMINMAX0.4150.4250.4150.4250.5000.5200.0380.0420.100 BSC0.0020.0100.0090.0110.0610.0710˚7˚0.4440.4480.7090.7250.2450.2550.1150.125MILLIMETERSMINMAX10.5410.7910.5410.7912.7013.210.961.072.54 BSC0.050.250.230.281.551.800˚7˚11.2811.3818.0118.416.226.482.923.17SWVCJKMPIN 1 IDENTIFIERH-T-SEATINGPLANEDIMABCDGHJKMNSVWCASE 482A-01ISSUE A
SMALL OUTLINE PACKAGE
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